Electroadhesive Stamp Places Microscopic Structures

Electroadhesive Stamp Places Microscopic Structures
Oct-14-19
An electroadhesive stamp able to pick up and place microscopic components could help usher in the next generation of tiny electronics.

As circuit boards get smaller, the tools used to create them have to adjust as well. To that end, the electroadhesive stamp created by the team from MIT can pick up and place down objects 1000 times finer than a human hair. The stamp features an array of ceramic-coated carbon nanotube bristles that will become charged when a small voltage is applied, causing a temporary electrical attraction that can be switched off and on to place the tiny components and assemble the device.

Electroadhesive Stamp Places Microscopic Structures


More Info about this Invention:

[SCIENCEMAG.ORG]
[NEWS.MIT.EDU]
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