Thermal Conductivity of Thin Films

A test structure is presented to measure thermal conductivity of thin film materials based on the Seebeck effect. Furthermore, a method for the fabrication of the test structure and a method for measuring the thermal conductivity with the test structure is presented. The test structure is fabricated by surface micromachining technology having the advantage that it can be easily monolithically integrated together with VLSI circuits and MEMS devices.

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Patents:
US 2,010,052,032

Inventor(s): WANG ZIYANG [BE]; FIORINI PAOLO [BE]

Type of Offer: Sale



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