Large Scale Nanoelement Assembly Method for Making Nanoscale Circuit Interconnects and Diodes

Nanoelements such as single walled carbon nanotubes are assembled in three dimensions into a nanoscale template on a substrate by means of electrophoresis and dielectrophoresis at ambient temperature. The current-voltage relation indicates that strong substrate-nanotube interconnects carrying mA currents are established inside the template pores. The method is suitable for large-scale, rapid, three-dimensional assembly of 1,000,000 nanotubes per square centimeter area using mild conditions. Circuit interconnects made by the method can be used for nanoscale electronics applications.

Attached files:
WO 2009126952.jpg

Patents:
WO 2,009,126,952

Inventor(s): SRIDHAR SRINIVAS [US]; GULTEPE EVIN [US]; NAGESHA DATTATRI [US]

Type of Offer: Licensing



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