Apparatus and Method for Applying a Film on a Substrate

A system that incorporates teachings of the present disclosure may include, for example, an apparatus having a plurality of applicators, each applicator with an ingress opening to receive a liquid, and an egress opening to release the liquid, and a conductor positioned in a conduit of each of the plurality of applicators, the conductor and the conduit having dimensions to cause a surface tension of the liquid to prevent a constant flow of the liquid from the egress opening. Each conductor of the plurality of applicators can be coupled to one of one or more power sources operable to apply a charge to the liquid to overcome the surface tension and form at the egress opening of each applicator a plurality of jet sprays of the liquid applicable on a substrate to form a thin film. Additional embodiments are disclosed.

Attached files:


Patents:
US 20,090,258,153

Inventor(s): KIM KYEKYOON [US]; CHOI HYUNGSOO [US]

Type of Offer: Licensing



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