Problem Solver
Rey John Limos
I am generally regarded as an out of the box thinker by my colleagues with a very good and well rounded background in manufacturing operations. In most of the projects that I have handled, I would like to be able to identify the critical metrics that needs to be improved and assess the success of potential solutions on how it affects these baseline metrics.
Areas Rey John Limos is Knowledgeable in:
manufacturing engineering, Engineering solutions, failure analysis and root cause determination. evaluations and verification runs.
Techniques Rey John Limos Uses:
Design of Experiments, Statistical Engineering, Statistical Process Control, FMEA with Error Proofing.
Rey John Limos's Problem Solving Skills:
- Process Engineering
- Maintenance and Calibration Engineering
- Quality Engineering
- Mass Production Engineering
- Design of Experiments
- Manufacturing Engineering
- Electromechanics and automation
- potential problem analysis and anticipation
- Packaging and Transport
- Continuous Improvement project management
Rey John Limos's Problem Solving Experience:
- I qualified a new material to solve a problem known in the semiconductor industry as cover tape tearing which occurs during the process of product retrieval from a tape and reel packaging. Evaluation conducted was to determine if the new material is better than those of existing material and by how much. The project was commended by our corporate office for its innovative approach and was awarded as the project of the 4th quarter 2007 under the Excellence Starts with You Program.
- An existing tape and reel equipment used in the packaging of semiconductor products was modified/upgraded to be able to do detaping functions. My role was in the quantification of the improvement idea in terms of qualified manufacturing metrics such as reject/yield perfomance, output difference, MTBF and MTBA metrics for the equipment. The project was commended by corporate office as one of the runner ups for the 2nd Quarter of 2007
- An equipment conversion procedure and setup requirement was improved by clustering of several product types into a common set-up/conversion jig. My role was in the creative identification of possible grouping of numerous package types (from a previous of 125 conversion types to just 25). Net result was in the reduction of equipment downtime associated with conversion set up procedures and increased equipment utilization and overall equipment efficiency. The project was commended during the 4th quarter of 2007 for its role in meeting the production demands at the time when increase requirement for detaping process was needed.
- Spearheaded the recycling of Silicon Gravure Pads in the ink marking operations. I conducted the evaluations, generation of formalized procedure on how to conduct the activity and presented a cost reduction from 40usd to 1usd in terms of material consumption cost.
- Back in the days when Tin Lead was used as solder plating material for leadframes of semiconductors, I spearheaded the use of 90% tin 10% lead anode ball in the chemical solutions used during electroplating. This results in a 70% savings in the cost of liquid chemical replenishment for the solder plate operations since Anode balls are cheaper in cost compared to its liquid counterparts.
- I have handled a project related to the bent leads reject for semiconductor project. I was involved in the process mapping leading to the red-x root cause identification. The project resulted in the cataloguing of failure mechanism as to the possible sources within the manufacturing arena leading to the early reaction time of engineers in terms of identifying and correcting incidences during a normal production run.