Areas Moti Margalit is Knowledgeable in:
optics, MEMs, optical packaging, fiber lasers, semiconductor packaging
Techniques Moti Margalit Uses:
TRIZ, SIT
Moti Margalit's Problem Solving Experience:
- i developed a novel wafer level packaging technology for image sensors
i developed a novel wafer level packaging technology for LEDs
i developed a novel stacking technology for semiconductor packaging
i developed novel integrated optic devices
i developed a novel sound generation system
i have over 45 pneding and accepted US patents in diverse fields ranging from optics and MEMs to cloud computing