HPCI Device Bonds Plastic and Metal in Seconds

Jan-31-19 A new device able to bond metal to plastic is both faster and more affordable than traditional methods.

Developed by the team at Fraunhofer, the handheld device relies on the HeatPressCool-Integrative (HPCI) process to bond metal and plastics without adhesives (which take time to set) or rivets (which can be expensive). Instead, the HPCI gun first pinches the two materials together at the bonding point, where the metal material has been etched to aid in anchoring. Then inductive heat is applied to the spot, causing the plastic to melt and penetrate the anchors before cooling and contracting to form a firm bond.

More Info about this Invention:

[NEWATLAS.COM]
[FRAUNHOFER.DE]

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