Method of Forming Mono-Crystalline Germanium or Silicon Germanium

A method is presented for forming mono-crystalline germanium or silicon germanium in a trench. In an embodiment, the method comprises providing a substrate comprising at least one active region that is adjacent to two insulating regions, forming in the active region a trench having a width of less than 100 nm, and forming in the trench a fill layer at a temperature of less than 450 DEG C. that comprises germanium or silicon germanium and substantially fills the trench. The method further comprises heating the fill layer to a temperature sufficient to substantially melt the fill layer and allowing re-crystallization of the substantially melted fill layer, thereby forming mono-crystalline germanium or silicon germanium in the trench. In an embodiment, the method further comprises forming a mono-crystalline germanium or silicon germanium fin by removing at least a portion of the insulating regions. The mono-crystalline fin may be comprised in a fin field-effect-transistor (finFET).

Patents:
US 20,110,097,881

Inventor(s): VANDERVORST WILFRIED [BE]; WANG GANG [BE]

Type of Offer: Sale



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