Method for Insertion Bonding and Device Thus Obtained

A method for insertion bonding and a device thus obtained are disclosed. In one aspect, the device includes a first substrate having a front main surface and at least one protrusion at the front main surface. The device includes a second substrate having a front main surface and at least one hole extending from the front main surface into the second substrate. The protrusion of the first substrate is inserted into the hole of the second substrate. The hole is formed in a shape wherein the width is reduced in the depth direction and wherein the width of at least a part of the hole is smaller than the width of the protrusion at the location of the metal portion thereof. The protrusion is deformed during insertion thereof in the hole to provide a bond between the part of the hole and the metal portion.

Attached files:
US 20110027967.jpg

Patents:
US 20,110,027,967

Inventor(s): BEYNE ERIC [BE]; LIMAYE PARESH [BE]

Type of Offer: Sale



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