Solution Processing Method for Forming Electrical Contacts of Organic Devices

The present invention relates to a method for forming, on an organic semiconductor layer, an electrical contact layer comprising a metal, the method comprising the steps of: (a) providing a charge collecting barrier layer on the organic semiconductor layer; (b) providing a liquid composition comprising a precursor for the metal on the charge collecting barrier layer; and (c) performing a sintering step; wherein the charge collecting barrier layer is substantially impermeable to the components of the liquid composition.

Attached files:
WO 2010054891.jpg

WO 2,010,054,891


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