Connecting Scheme for Orthogonal Assembly of Microstructures

In the present disclosure a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way, out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Connections to external circuitry can be realised. Microfluidic channels (10) in the microstructures (20) can be connected to external equipment. A method to fabricate and assemble the device is provided.

Attached files:


Patents:
US 20,090,325,424

Inventor(s): AARTS ARNO [BE]; PEREIRA NEVES HERCULES [BE]; VAN HOOF CHRIS [BE]; BEYNE ERIC [BE]; RUTHER PATRICK [US]; PUERS ROBERT [US]

Type of Offer: Sale



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