Systems and Methods for Enhanced Control of Laser Drilling Processes

Systems and methods are provided for monitoring and/or controlling laser drilling processes based on atomic emission spectral emissions that are collected in real time during laser drilling. The systems and methods may be used to monitor and control laser drilling operations across a range of materials, e.g., metals (including alloys) and ceramics, and may be used to identify spectral characteristics that signify hole completion and to manage/discontinue laser drilling operations based thereon. The ability to precisely monitor for hole completion provides the important advantage of reducing unnecessary laser pulses, which otherwise could reduce manufacturing efficiency and/or increase thermal or mechanical damage to the component material. The systems and methods may also be employed to control laser drilling operations so as to enhance hole quality and/or to implement corrective action when/if necessary to ensure that laser drilling operations yield high quality drilled holes.

Attached files:
US 20110017715.jpg

Patents:
US 20,110,017,715

Inventor(s): MARCUS HARRIS L [US]; BRIGHT ROBIN [US]

Type of Offer: Licensing



Next Patent »
« More Engineering - Mechanical Patents

Share on      


CrowdSell Your Patent