Methods for Forming Metal-polymer Hybrid Tooling for Forming Parts Having Micro Features
A method (10, 100) for forming metal-polymer hybrid tooling includes patterning a surface of a silicon wafer (20, 420), depositing a polymer material (30, 430) onto the patterned features of the surface of the silicon wafer to form a polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer (30, 430) on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts (450) with features having a width dimension between about 0.1 microns and about 100 microns and a height dimension of between about 1 micron and about 800 microns (e.g., up to aspect ratio of 8).
YOON SUNG-HWAN [US]; CHA NAM-GOO [US]; BARRY CAROL M F [US]; MEAD JOEY L [US]; BUSNAINA AHMED A [US]
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