Conductive Formulations for Use in Electrical, Electronic and Rf Applications

Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microp articles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.

Patents:
WO 2,010,065,503

Inventor(s): NAGARAJAN RAMASWAMY [US]; BALASUBRAMANIAM SHARAVANAN [US]; CHEN JULIE [US]; MEAD JOEY [US]

Type of Offer: Licensing



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