Method for Fast Macropore Etching in N-type Silicon
Electrochemical etching of macropores in n-type silicon wafers under illumination of wafer's rear side by use of an aqueous electrolyte, is claimed, where the electrolyte is an aqueous acetic acid solution of a composition comprising water:acetic acid in a ratio of 2:1 and 7:3 with a mixture of at least 9 wt.% of hydrogen fluoride.
OSSEI-WUSU EMMANUEL [DE]; COJOCARU ALA [DE]; CARSTENSEN JUERGEN [DE]; FOELL HELMUT [DE]
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