Surface Plasmon Dispersion Engineering Via Double-metallic Au/ag Layers for Nitride Light-emitting Diodes

A double-metallic deposition process is used whereby adjacent layers of different metals are deposited on a substrate. The surface plasmon frequency of a base layer of a first metal is tuned by the surface plasmon frequency of a second layer of a second metal formed thereon. The amount of tuning is dependent upon the thickness of the metallic layers, and thus tuning can be achieved by varying the thicknesses of one or both of the metallic layers. In a preferred embodiment directed to enhanced LED technology in the green spectrum regime, a double-metallic Au/Ag layer comprising a base layer of gold (Au) followed by a second layer of silver (Ag) formed thereon is deposited on top of InGaN/GaN quantum wells (QWs) on a sapphire/GaN substrate.

Patents:
WO 2,011,072,011

Inventor(s): TANSU NELSON [US]; ZHAO HONGPING [US]; ZHANG JING [US]; LIU GUANGYU [US]

Type of Offer: Licensing



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