System and Method to Measure Nano-scale Stress and Strain in Materials
A system for measuring stress and strain in a sample is provided. The system includes a sample holder operable to support the sample; a stress inducing assembly operable to apply force to a selected location on the sample to deform the sample by a selected distance in a range from about 0.1 angstrom to about a millimeter; and an interferometer operable to determine a surface topography of the deformed sample at a resolution in a range from about 0.1 angstrom to about a micron.
LUTTGE ANDREAS [US]; UDWADIA FIRDAUS [US]; NEALSON KENNETH H [US]; GOODMAN STEVEN D [US]
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