System and Method to Measure Nano-scale Stress and Strain in Materials

A system for measuring stress and strain in a sample is provided. The system includes a sample holder operable to support the sample; a stress inducing assembly operable to apply force to a selected location on the sample to deform the sample by a selected distance in a range from about 0.1 angstrom to about a millimeter; and an interferometer operable to determine a surface topography of the deformed sample at a resolution in a range from about 0.1 angstrom to about a micron.

Attached files:
US 20110032511.jpg

Patents:
US 20,110,032,511

Inventor(s): LUTTGE ANDREAS [US]; UDWADIA FIRDAUS [US]; NEALSON KENNETH H [US]; GOODMAN STEVEN D [US]

Type of Offer: Licensing



Next Patent »
« More Nanotech Patents

Share on      


CrowdSell Your Patent