Methods for Wafer Bonding, and for Nucleating Bonding Nanophases
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
HERBOTS NICOLE [US]; CULBERTSON ROBERT J [US]; BRADLEY JAMES [US]; HART MURDOCK ALLEN [US]; SELL DAVID ALEXANDER [US]; WHALEY SH
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