Methods for Attaching Flexible Substrates to Rigid Carriers and Resulting Devices

Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219 DEG C and 1000 DEG C and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.

Patents:
WO 2,010,051,106

Inventor(s): LOY DOUGLAS E [US]; O'ROURKE SHAWN M [US]

Type of Offer: Licensing



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