Two/three-dimensional multi-layer circuit carrier producing method for e.g. automobile industry, involves applying layer of strip conductor and dielectric layer on topmost dielectric layer alternative
The method involves applying a dielectric layer (4) i.e. thermoplastic polymer layer, on certain regions of a set of electrical strip conductors (2) and the surface of a two/three-dimensional basebody (1) by injection moulding. Another set of electrical strip conductors (6) is applied on the surface of the dielectric layer by metallization process. Another dielectric layer (8) is applied on certain regions of the conductors (6). A layer of a strip conductor and a third dielectric layer are applied on the topmost dielectric layer alternatively.
LENEKE THOMAS [DE]; KADEN DIRK [DE]; HIRSCH SOEREN [DE]; SCHMIDT BERTRAM [DE]
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