Carbon Nanotube-based Thermal Interface Material

Introduction Thermal management is an increasingly serious challenge for the semiconductor device industry as the density of circuit elements continues to increase in accordance with Moore’s Law. Effective methods to remove heat are essential to proper packaging and operation of next generation integrated circuits. Technology description A process has been developed at the University of Washington to capitalize on the high thermal conductivity of carbon nanotubes by incorporating them in a polymer matrix, thus creating a material with high thermal transport properties for IC chip and laser diode packaging. Business opportunity Fifty percent of the Difficult Challenges identified in the International Technology Roadmap for Semiconductors are related to solving thermal issues. A highperformance thermal interface material (TIM) will allow heat from IC and laser diode packages to be conducted to heatsinks or heat spreaders, and dissipated or removed at the board level. Competing approaches such as fans and spray cooling are too costly and cumbersome for most electronic systems. Stage of development The superior performance of the TIM developed at the UW has been demonstrated, and pilot-level quantities have been produced. The technology is available for licensing. Intellectual property position A U.S. patent has been issued to protect the TIM technology

Type of Offer: Licensing



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