Cooling System for High Power Diode Laser Bar
Introduction There are currently a number of approaches being used to package (cool) high power laser diode bars. The most standard is a simple copper heat spreader below the diode. For high power laser diodes, this is problematic due to thermally induced stresses that result in a short lifetime. Technology description Researchers at the UW have developed a device to cool a high power laser diode bar that generates 60 to 100 Watts of thermal power in a footprint of 0.1 square centimeter, for an equivalent heat flux output of 600 to 1000 Watts/cm2. The cooling system controls the temperature of the diode bar at a set-point of approximately 55 degrees C to within +/- 0.5 degrees C, while the ambient air temperature may vary from -10 degrees C to 50 degrees C. Business opportunity This design is unique in that it is simple and very effective in dissipating the heat generated by the diode. It is also highly reliable with no moving parts. Stage of development Initial data exist for this technology. Intellectual property position This technology is available for licensing. The UW is currently reviewing this technology for worldwide patent protection.
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