Electroplating of Hard Glassy Metals (MFS-31377)
Although it yields a high quality coating, electroless deposition does not allow for much process control, requires high processing temperatures, and has a slower deposition rate than with electroplating. Better process control is available through electroplating, which involves placing a voltage across a nickel electrode (i.e., anode) and the part in a solution (i.e., cathode) and thus driving the nickel to coat the part via electrolytic processes. NASA Marshall¿s technology enables stress-free plating, deposits glassy metal alloys at higher rates, and provides deposition at a much lower processing temperature than with electroless deposition. Plating rates are constant and predictable, and coatings can be extremely hard. The versatile process can be used to electroform free-standing shapes with any specified size or thickness using soluble anodes for metal replenishment. Coating materials can range from nonmagnetic to highly magnetic metals, metals with glassy nickel properties, free machining alloys, corrosion-resistant alloys, decorative blue oxides, and non-reflective black oxide. This process also mitigates the need for constant chemical metal replenishment. The phosphorous is replaced at 1:1 consumption, unlike the 5:1 rate of electroless processes. Buildup of harmful byproducts is minimal, and solutions can be left unattended for very thick deposit growth. These features result in a safer and more environmentally favorable process.
Attached files:633_Electroplating of Hard Glassy Metals.pdf
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