Fabrication of Bioelectronic Material

Background Current fabrication methods of electronic or electroactive materials are inherently 2-D and involve expensive lithographic masks, complicated stamping, etc. Furthermore, current strategies have not proven useful for creating complex 3-D assemblies.

Invention Description The use of direct-write lithography technique offers exceptional promise as a more direct assembly protocol for fabrication of functional bioelectronic elements. Soluble proteins are photo-crosslinked using multi-photon excitation (MPI). These photo-crosslinked structures are written using a mechanical xy stage to translate the laser beam across the coverslip. These structures can be created in various shapes including lines, boxes, and freestanding arcs.

Benefits

Capable of fabricating complex submicron 3-D structures Complex, multicomponent assemblies can be synthesized Freeform fabrication

Features

Direct-write lithography technique Represents a strategy for microfabricating electronic and electroactive materials Well-defined three-dimensional topographies retain specific and nonspecific binding capabilities

Market Potential/Applications This technology has many potential applications within the billion-dollar electronic materials industry including companies involved in: 3-D lithography biosensors physiological monitors

Development Stage Proof of concept

IP Status One U.S. patent application filed

UT Researcher Jason B. Shear, Ph.D., Chemistry and Biochemistry, The University of Texas at Austin Ryan T. Hill, BS, Chemistry and Biochemistry, The University of Texas at Austin Keith J. Stevenson, Ph.D., Chemistry and Biochemistry, The University of Texas at Austin Jennifer L. Lyon, BS, Chemistry and Biochemistry, The University of Texas at Austin


OTC Contact Information , Licensing Specialist

512-471-4919

Type of Offer: Licensing



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