Wafer Level Package Structure, and Sensor Device Obtained from the Same Package Structure

A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface.

The present invention relates to a wafer level packaging technique for manufacturing compact sensor devices such as an acceleration sensor and a gyro sensor.

A primary concern of the present invention is to provide a wafer level package structure capable of providing compact sensor devices having small variations in sensor characteristics, which is formed by bonding a semiconductor wafer with a plurality of compact sensor elements such as acceleration sensors and gyro sensors to a package wafer without almost causing residual stress at the bonding interface.

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Patents:
JP 2,006,323,453   [MORE INFO]

Inventor(s): OKUDO TAKAFUMI [JP]; SUZUKI YUJI [JP]; TAKEGAWA YOSHIYUKI [JP]; BABA TORU [JP]; GOTOU KOUJI [JP]; MIYAJIMA HISAKAZU [JP]; KATAOK

Type of Offer: Sale



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