Systems and Methods for Recycling Semiconductor Material Removed from a Raw Semiconductor Boule

Methods of recycling excess semiconductor material removed from an unshaped semiconductor boule are disclosed. Excess semiconductor material is cut from an semiconductor unshaped boule thereby generating a shaped semiconductor boule. The excess semiconductor material is removed in the form of large pieces that can easily be cleaned and retrieved for reuse.

This invention was made with government support under Grant number NSF-0512897 awarded by the National Science Foundation. The United States government has certain rights to this invention.

One aspect of the invention is directed to a method of recycling excess semiconductor material removed from an unshaped semiconductor boule. A wire electron discharge machine is provided. Excess semiconductor material is cut from an unshaped semiconductor boule using the wire electron discharge machine thereby generating a shaped semiconductor boule. The excess semiconductor material is in the form of large pieces and retrieved for reuse.

Another aspect of the invention is directed to a method of recycling excess semiconductor material removed from an unshaped semiconductor boule. The method includes providing a wire saw device, providing an unshaped semiconductor boule, cutting excess semiconductor material from the unshaped semiconductor boule using the wire saw thereby generating a shaped semiconductor boule, and retrieving the excess semiconductor material from the wire saw device for reuse.

Another aspect of the invention is directed to a system for recycling excess semiconductor material removed from an unshaped semiconductor boule. The system includes means for removing excess semiconductor material from an unshaped semiconductor boule in the form of large pieces thereby generating a shaped semiconductor boule, means for retrieving the excess semiconductor material is in the form of large pieces and means for reusing the retrieved excess semiconductor material in a melt.

Attached files:
2010199909A1.pdf

Patents:
US 20,100,199,909

Inventor(s): BAMBERG EBERHARD [US]; RAKWAL DINESH R [US]; JORGENSEN DEAN [US]; HARVEY IAN R [US]; FREE MICHAEL L [US]; BALAJI ALAGAR K [US]

Type of Offer: Sale



« More Recycling Patents

---