The device has a cooling body (2) for removing heat from an electronic component (1) e.g. processor, during operation of the device. Air ducts are arranged in a conical form or a hyperboloid form above the cooling body and are made of non heat-retaining material. The air ducts have a cross section with four symmetrical axes e.g. quadratic cross section, and arranged in matrix or web shape. An inner wall of the air ducts is provided with a dirt-repellent coating. The cooling body is formed by a part of a DIN-rail, where the part is bent around 90 degrees.
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