Finely-crystalline soldered joint for joining semiconductor chips to support - using solder foil, temp. of which is held just below the liquids after wetting support

A process is disclosed for mfg. a mechanically stable, finely crystalline soldered joint, particularly for power electronics components. Amorphous, finely-crystalline or conventional solder materials are used. Soldering is carried out using a solder foil inserted between the metallic or metallised support and the metallised semiconductor chip in an inert gas atmos. The solder foil is applied as a previously-mfd. item to the support. The temp. in the plane of the joint is reduced to 20-30 deg.K below the liquidus of the solder, and held at this level for 10-40 seconds before the application of the metallised chip. After soldering, the complete joint system is cooled to room temp. at 20-28 deg.K/minute. Pref the solder is used in a rapidly-solidified, finely-crystalline form. The rougher side of the solder foil is placed in contact with the support. ADVANTAGE - The wetting of the components by the solder is improved, the chip/solder/support structure has few defects, and the fatigue strength of the joint is improved

Patents:
DE 4,103,940

Inventor(s): ALBRECHT HANS-JUERGEN [DE]; HERBERT FRITZ [DE]; FOEST ILONA [DE]; RATHMANN BRIGITTE [DE]; RATHMANN RAINER [DE]; SCHEEL WOLFGANG

Type of Offer: Sale



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