Mounting Method, Board with Electrical Component, and Electrical Apparatus

An electric device having high reliability is to be produced. An adhesive layer 20 includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer 20 is protruded outwardly from an edge of the electric part 15. Radiation rays 29 do not pass through the electric part 15, and the radiation-curable resin is cured in the protruding portion 26, while the radiation-curable resin in that portion of the adhesive layer 20 which is positioned right behind the electric part 15 is not polymerized. Since the electric part 15 is fixed with the polymerized radiation-curable type resin, the electric part 15 is not misaligned when the electric part 15 is pressed under heating.

Patents:
JP 1,993,124

Type of Offer: Sale



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