Matt Egbe

- “Composition for removing photoresist and/or etching residue from a substrate and use thereof”
US 9,217,929
- “Composition for stripping and cleaning and use thereof” US 8,440,599
- “Stripper for dry film removal” US 8,357,646
- “Aqueous stripping and cleaning composition” US 8,231,733
- “Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same”
US 8,110,535
- “Composition for stripping and cleaning and use thereof” US 8,030,263
- “Composition for removal of residue comprising cationic salts and methods using same” US 7,700,533
- “Semi-aqueous stripping and cleaning composition containing aminobenzenesulfonic acid“ US 7,687,447
- “Formulation for removal of photoresist, etch residue and BARC“ US 7,674,755
- “Compositions for the removal of organic and inorganic residues” US 7,361,631