ICECool Cools Microchips with Water Droplets

Mar-11-16 The ICECool-Applications research program could see microchips cooled internally with tiny drops of water, opening the door to faster—and smaller—electronics.

Developed by Lockheed Martin as part of DARPA's Microsystems Technology Office's (MTO) Inter/Intra Chip Enhanced Cooling program, the chips take advantage of microfluidic cooling, which relies on microscopic drops of water within an integrated system inside the chip to draw away heat. Currently, Lockheed Martin has moved through two phases of the technology, and is working on a fully functional transmit antenna prototype to develop the technology further.

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[DARPA.MIL]
[LOCKHEEDMARTIN.COM]

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