Liquid-Cooling for Smartphones

Mar-16-15 Fujitsu's liquid-cooled smartphone technology is able to transfer heat five times more effectively than current methods, and could prove useful as our devices become more complex.

Currently, sheets of metal or graphite are used to channel the excess heat from smartphones, but Fujitsu believes those materials will not be able to meet future performance demands. To address the problem, the company has developed the "loop heat pipe" transfer system: a thin device under a millimeter thick and filled with a liquid coolant that moves the heat to a cooler area of the smartphone or tablet. The system also requires no battery, since it runs off the heat generated by the device.

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[ZDNET.COM]
[FUJITSU.COM]

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