Inventor

George Gregoire

Fundamentally new and extremely cost-advantaged way of making advanced PCB circuits, especially suitable for high density interconnect (boards for cellphones, IC packaging, etc.). Process steps literally cut in half, savings range from 35% to 60%+
Imprint Patterned circuit substrates are also much more precise, since the are "stamped" out by an extremely precise Toolfoil in an ordinary laminating press. Linewidths are within 2% or better (limit of measuring equipm.)