Methodology of Controlling Flow of Molten Solder or Braze in Reactive Multilayer Joining

Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This invention introduces a methodology of controlling flow of molten solder or braze in reactive joining to improve the joining performance. The method is based on control of the pressure that is applied during joining, and the effect that the volume and the duration of melting of the solder or braze material has on the pressure that is required. Description (Set) Proposed Use (Set) Previous research on joining components using reactive foils and solder or braze materials showed that there is a large amount of the AuSn solder flowing out of the joining area. The flow of molten solder out of the joint area limits the application of this method when joining components onto very delicate electronic board because the splash of solder material due to the high applied joining pressure may damage other components and circuit lines on the same board. This patent described a methodology of controlling the flow of the molten solder or braze material in reactive joining by varying applied joining pressure for a given material system, in order to ensure good wetting and joining, and minimize the extrusion of the molten solder or braze material out of the joining area.

Inventor(s): Wang, Jiaping

Type of Offer: Licensing

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