Thermally Transformable Periodic Mesoporous Organosilica (PMO) Thin Films for Low Dielectric Constant Applications

Background

Periodic mesoporous organosilica (PMO) thin films have been investigated in various applications requiring specific optical, magnetic, or electrical properties. These well-defined porous films have specifically shown their interest in the microelectronics industry for application as low dielectric constant insulating layers for the next generations of chips. This improvement in dielectrics reduces crosstalk, reduces the ‘RC’ delay caused by interlayer capacitance, and can reduce the overall power consumption as the device density of chips continues to increase.

Technology

A PMO thin film is synthesized incorporating specific bridging organics groups that are thermally transformed under distinct temperatures wherein dramatic improvements are seen in moisture sensitivity, dielectric constant, and elastic modulus. Other properties are currently under investigation may prove useful in optical coatings, DNA/lab chip manufacturing, abrasion resistance, and low index of refraction applications.

Business Opportunity

The Innovations Group is seeking a licensee or partner to develop the technology on a commercial scale.

Patent Status

International PCT patent application was published on March 30, 2006 (publication #WO 2006/032140 A1). European, Japanese, and Korean patent applications have been filed based on the International Application.

Type of Offer: Licensing



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