Materials science/engineering, nanotechnology, self-assembly, thermal materials, bonding materials, adhesives, high temperature stable materials, reliability, failure analysis.
Techniques Hitesh Arora Uses:
I like to break down problems into smaller fundamental, solvable parts, and then integrating solutions of the small individual problems to a complete solution.
I have had most success when I have taken inspiration from a completely different field with similar fundamental problems to formulate a solution.
- I demonstrated a novel method to generate nanostructured single crystal materials using block copolymer self-assembly. This work was published in high profile journal Science and covered through various scientific news agencies.
- I developed materials to enable thermo-electric device performance at high temperatures (>350C).
- I led projects at Intel Corporation to design next-generation of materials including thermal materials, adhesives for flip-chip packages. I was awarded Intel “high-5” patent award.