Electrospray Evaporative Spray Cooling (EESC)

Introduction As electronic devices get increasingly more powerful and more compact, there are an increasing number of semiconductor components that emit an increasing amount of heat. In order to ensure that these devices remain long-lived and reliable, more efficient methods of dissipating heat buildup is essential. Conventional cooling techniques, such as heat sinks and convective airflow, are becoming less and less appropriate for the evolving electronics landscape. However, evaporative spray cooling is able to dissipate high heat fluxes and shows great promise as efficient thermal management for microelectronics. Technology Description Professor Mamishev at the University of Washington has developed a technique that utilizes electrospray ionization to more efficiently realize the benefits from evaporative spray cooling. In electrospray ionization, an applied voltage triggers the atomization of the cooling fluid and its acceleration toward a target. The result is a blanket of fine droplets of coolant on the target that optimize heat transfer from the component and dissipate that heat through evaporation. Business Opportunity Electrospray evaporative spray cooling (EESC) presents opportunities throughout the field of electronics. It is especially suitable for high-performance computing and critical systems. As personal electronics get smaller and more powerful, though, this technique will also have increased relevance in those markets. Intellectual Property Position The UW has patents pending on this technology. For more information on this technology contact:
Patrick Shelby Technology Manager jpshelby@u.washington.edu 206-543-3970

Type of Offer: Licensing



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