Electrolytic Copper Coating and Method of Manufacture Therefor, and Copper Electrolyte for Manufacturing Electrolytic Copper Coatings

An object of the present invention is to provide an electrolytic copper coating that exhibits a bendability and flexibility equal to or better than those of rolled copper foil after the heat history in a circuit board fabrication process, especially after a heat history equivalent to the heat history applied when bonding with a polyimide film. The present invention provides an electrolytic copper coating and a method of manufacturing the same wherein, when performing heat treatment so that the LMP value shown in Equation 1 becomes 9000 or more, the result becomes a crystal distribution of crystal grains, having a maximum length of crystal grains after heat treatment of 10 [mu]m or more, of 70% or more: LMP = T + 273 * 20 + Logt where, 20 is a material constant of copper, T is temperature ( DEG C), and t is time (hr).

Patents:
JP 2,009,060,792

Inventor(s): SAITO TAKAHIRO [JP]; SUZUKI YUJI [JP]; IUCHI SHOYA [JP]; NISHIKAWA TETSUJI [JP]

Type of Offer: Sale



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