Multi-wire Electron Discharge Machine

A multi-wire electron discharge machine includes a first wire electrode for creating an electrical discharge between the first electrode wire and a semiconductor ingot, a second wire electrode for creating an electrical discharge between the second electrode wire and the semiconductor ingot, and a wire guide for maintaining the first wire electrode in a spaced apart and generally parallel orientation with respect to the second wire electrode across a semiconductor ingot slicing area.

This invention was made with government support under Grant number NSF-0512897 awarded by the National Science Foundation. The United States government has certain rights to this invention.

The invention relates generally to semiconductor manufacturing and more specifically to a multi-wire electron discharge machine for simultaneously slicing multiple semiconductor wafers from a semiconductor ingot.

Attached files:


Patents:
US 20,100,187,203

Inventor(s): BAMBERG EBERHARD [US]; RAKWAL DINESH R [US]

Type of Offer: Sale



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