A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device 1 includes first and second pressing rubbers 15, 25. Electric components 32, 33 can be simultaneously packaged on the front face and the rear face of a substrate 31 by sandwiching the substrate 31 between the first and second pressing rubbers 15, 25. The electric components 32, 33 are not subjected to a force for horizontally moving them because the first and second pressing rubbers 15, 25 are prevented from horizontal extension by a first dam member 16. Thus, the electric components 32, 33 are connected to the substrate 31 without misalignment, thereby obtaining a highly reliable electric device 30a.
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