A semiconductor package which comprises a base frame and a wiring substrate mounted on the base frame. The base frame comprises two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate comprises electric wiring tracks providing the electric connection between the first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
LIMAYE PARESH [BE]; VANFLETEREN JAN [BE]; BEYNE ERIC [BE]
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