Surface-treated Copper Foil and Copper-clad Laminate

To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, wherein Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount) x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount); x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more.

Patents:
JP 2,009,063,095

Inventor(s): FUJISAWA SATOSHI [JP]; SUZUKI YUJI [JP]; UNO TAKEO [JP]

Type of Offer: Sale



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