Method for Forming an Electronic Device in Multi-layer Structure

A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing; defining microgrooves in the multilayer structure by solid state embossing; and forming a switching device inside the microgroove.

Attached files:
US 20100051916.jpg

Patents:
US 20,100,051,916

Inventor(s): SIRRINGHAUS HENNING [GB]; FRIEND RICHARD HENRY [GB]; STUTZMANN NATALIE [NL]; SMITH PAUL [CH]

Type of Offer: Sale



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