Thermocompression Bonding Head and Mounting Device Using the Same
The present invention provides a thermocompression bonding head capable of mounting an electric component on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head 3 includes a heatable metal head body 5 having an elastic pressure-bonding member 7 made of elastomer and a metal pressing member 5b. The metal pressing member 5b, corresponding to an electric component 20 as a target to be bonded with pressure, is provided as a united body with the head body 5, and the elastic pressure-bonding member 7 is attached to the head body 5 such that a pressing surface 50 of the metal pressing member 5b is exposed in a recessed state on the periphery of the metal pressing member 5b. The head body 5 is made of a frame-shaped member having a concave portion 5a, and the metal pressing member 5b is integrally formed in the concave portion 5a of the head body 5. Further, the elastic pressure-bonding member 7 is housed and attached in the concave portion 5a.
The present invention relates to a technology for mounting a variety of electric components. More particularly, the present invention relates to a thermocompression bonding head for mounting an electric component using an adhesive agent and to a mounting device using the same.
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